Saturday, October 26, 2019

Examining The Evolution Of Integrated Circuits Information Technology Essay

Examining The Evolution Of Integrated Circuits Information Technology Essay In electronics, an integrated circuit also known as IC, microcircuit, microchip, silicon chip, or chip is a miniaturized electronic circuit (consisting mainly of semiconductor devices, as well as passive components) that has been manufactured in the surface of a thin substrate of semiconductor material. Integrated circuits are used in almost all electronic equipment in use today and have revolutionized the world of electronics. A hybrid integrated circuit is a miniaturized electronic circuit constructed of individual semiconductor devices, as well as passive components, bonded to a substrate or circuit board. Integrated circuits were made possible by experimental discoveries which showed that semiconductor devices could perform the functions of vacuum tubes, and by mid-20th-century technology advancements in semiconductor device fabrication. The integration of large numbers of tiny transistors into a small chip was an enormous improvement over the manual assembly of circuits using discrete electronic components. The integrated circuits mass production capability, reliability, and building-block approach to circuit design ensured the rapid adoption of standardized ICs in place of designs using discrete transistors. Invention The idea of an integrated circuit was conceived by a radar scientist working for the Royal Radar Establishment of the British Ministry of Defence, Geoffrey W.A. Dummer (1909-2002), who published it at the Symposium on Progress in Quality Electronic Components in Washington, D.C. on May 7, 1952. He gave many symposia publicly to propagate his ideas. Dummer unsuccessfully attempted to build such a circuit in 1956. The integrated circuit can be credited as being invented by both Jack Kilby of Texas Instruments and Robert Noyce of Fairchild Semiconductor working independently of each other. Kilby recorded his initial ideas concerning the integrated circuit in July 1958 and successfully demonstrated the first working integrated circuit on September 12, 1958. In his patent application of February 6, 1959, Kilby described his new device as à ¢Ãƒ ¢Ã¢â‚¬Å¡Ã‚ ¬Ãƒâ€¦Ã¢â‚¬Å"a body of semiconductor material wherein all the components of the electronic circuit are completely integrated.à ¢Ãƒ ¢Ã¢â‚¬Å¡Ã‚ ¬Ã‚  Kilby won the 2000 Nobel Prize in Physics for his part of the invention of the integrated circuit. Robert Noyce also came up with his own idea of integrated circuit, half a year later than Kilby. Noyces chip had solved many practical problems that the microchip developed by Kilby had not. Noyces chip, made at Fairchild, was made of silicon, whereas Kilbys chip was made of germanium. Early developments of the integrated circuit go back to 1949, when the German engineer Werner Jacobi (Siemens AG) filed a patent for an integrated-circuit-like semiconductor amplifying device showing five transistors on a common substrate arranged in a 2-stage amplifier arrangement. Jacobi discloses small and cheap hearing aids as typical industrial applications of his patent. A commercial use of his patent has not been reported. A precursor idea to the IC was to create small ceramic squares (wafers), each one containing a single miniaturized component. Components could then be integrated and wired into a bidimensional or tridimensional compact grid. This idea, which looked very promising in 1957, was proposed to the US Army by Jack Kilby, and led to the short-lived Micromodule Program (similar to 1951s Project Tinkertoy). However, as the project was gaining momentum, Kilby came up with a new, revolutionary design: the IC. The aforementioned Noyce credited Kurt Lehovec of Sprague Electric for the principle of p-n junction isolation caused by the action of a biased p-n junction (the diode) as a key concept behind the IC. Scale of integration Small Scale Integration (SSI): SSI were the first integrated circuits, which contained only a few transistors. They consisted of circuits, containing transistors numbering in the tens. SSI circuits were vital to early aerospace projects. The Minuteman missile and the Apollo program both needed lightweight digital computers for their inertial guidance systems. the integrated-circuit technology development was led by the Apollo guidance computer, while the Minuteman missile bolstered it into mass-production. The purchase of almost all of the available integrated circuits from 1960 through 1963, was from these programs, and basically almost provided the demand that funded the production improvements. In turn this got the production costs from $1000 per circuit (in 1960 dollars) to a mere $25 per circuit (in 1963 dollars). They began to become used in consumer products at the turn of the decade, for example in FM inter-carrier sound processing in television receivers. Medium Scale Integration (MSI): In this devices which contained hundreds of transistors on each chip. Also, these cost little more to produce than SSI devices, and also allowed more complex systems to be produced, using smaller circuit boards and less assembly work (due to fewer individual components). Large Scale Integration (LSI): Large-Scale Integration ( LSI ) by the mid 1970s. Chips now were developed with tens of thousands of transistors. Integrated circuits such as 1K-bit RAMs, calculator chips, and the very first microprocessors had under 4000 transistors and saw a moderate quantity of manufacture in the early part of 1970. True LSI circuits, were approaching 10000 transistors and began to be produced for computer main memories and second-generation microprocessors in around 1974 . Very Large Scale Integration (VLSI): Starting in the 1980s and continuing through to this day, was Very Large-Scale Integration (VLSI). This starts with hundreds of thousands of transistors in the early 1980s, and continues beyond several billion transistors as of 2007. No single breakthrough allowed the increase in complexity. Manufacturing moved to cleaner fabs and smaller rules, which allowed them to produce chips with more transistors with adequate yield, (summarized by the International Technology Roadmap for Semiconductors). Design tools also saw much improvement, this was enough to make it practical to finish the designs in reasonable times. Energy efficient CMOS replaced NMOS and PMOS, which avoided a prohibitive increase in power consumption. Many other factors helped also. By 1986 the first one megabit RAM chips were introduced, these contained more than a million transistors. 2005 saw microprocessor chips passing the billion transistor mark. The trend continues largely unabated, with chips introduced in 2007 containing tens of billions of memory transistors. Ultra Large Scale Integration (ULSI): Ultra-Large Scale Integration was proposed for chips of complexity of more than 1 million transistors. Wafer-scale integration (WSI): Wafer-scale integration (WSI) is a system of building extremely large integrated circuits that uses a whole silicon wafer to produce a single super-chip. Through a combination of large size and reduced packaging, WSI could lead to dramatically reduced costs for some systems, notably in massively parallel supercomputers. The name is taken from the term Very-Large-Scale Integration, the current state of the art during the development time of WSI. System-on-a-Chip (SoC or SOC): It is an integrated circuit where all the components needed for a computer (or other system), are included on a single chip. The design of this device can be costly and extremely complex, and also building disparate components on a single piece of silicon, could compromise the efficiency of some of its elements. Nevertheless these drawbacks are offset by low manufacturing and assembly costs, and by a vastly reduced power budget (as the signals among the components are kept on-die, much less power is required). Three Dimensional Integrated Circuit (3D-IC): It has two or more layers of active electronic components, these are integrated both horizontally and vertically into a single circuit. Communication between the layers relies on on-die signaling, so the power consumption is lower than that of equivalent separate circuits. Sensible use of short vertical wires can substantially reduce the total wire length, for faster operation and efficiency. Classification of ICs by Structure: 1.Monolithic ICs 2.Hybrid or Multichip ICs Thin film Thick film Monolithic ICs: In these ICs all circuit components (i.e. active and passive) are fabricated inseparable within a single continuous piece of silicon crystalline material called WAFER. In Monolithic ICs all components are formed simultaneously by a diffusion process. Then a metallization process is used in interconnecting these components to form the desired circuit. Hybrid ICs: In Hybrid ICs passive components (such as resistors and capacitors) and the interconnection between them are formed on an insulating substrate, the substrate is used as a chassis for the integrated components .Active components such as transistors and diodes, as well as Monolithic ICs are then connected to form a complete circuit. Hybrid ICs are further classified as Thin Film and Thick Film, depending on the method used to form the resistor, capacitor and related interconnections on the substrate. 1.Thin Film: When a suitable material is evaporated on substrate informing resistors, capacitors and interconnections, a Thin Film Hybrid IC is obtained. 2.Thick Film: When the resistors, capacitors andinterconnections are etched on the substrate by silk screening, a Thick Film Hybrid IC is obtained. Classification of ICs by Function: Linear ICs: They perform amplification and other essential linear operation on signals. Non Linear ICs: They require only ON-OFF operation of the transistor, thus the design requirements for these circuits are less stringent than those of linear ICs. ICs can be classified into ANALOG, DIGITAL and MIXED SIGNAL Digital integrated circuits: It contain anything from one to millions of logic gates, flip-flops, multiplexers, and other circuits in a few square millimeters. The small size of these circuits allows high speed, low power dissipation, and reduced manufacturing cost compared with board-level integration. These digital ICs, typically microprocessors, DSPs, and micro controllers work using binary mathematics to process one and zero signals. Analog Integrated cicuits: It contains sensors, power management circuits, and operational amplifiers, work by processing continuous signals. They perform functions like amplification, active filtering, demodulation, mixing, etc. Analog ICs ease the burden on circuit designers by having expertly designed analog circuits available instead of designing a difficult analog circuit from scratch. Mixed integrated cicuits: ICs can also combine analog and digital circuits on a single chip to create functions such as A/D converters and D/A converters. Such circuits offer smaller size and lower cost, but must carefully account for signal interference. IC TERMINOLOGY Some common terms used in fabricating ICs are: Bonding: Attaching the die on ceramic substrate and then connecting the leads to the package. Chip: An extremely small part of silicon wafer on which IC is fabricated. Circuit Probing: Testing the electrical performance of each IC chip with the help of microscope. Diffusion: A process that consist of the introduction of impurities into selected regions of a wafer to form junctions. Encapsulation: putting a cap over the IC and sealing it in an inert atmosphere. Epitaxy: A process of controlled growth of a crystalline doped layer of silicon on a single crystal substrate. Mask: A glass plate with desired pattern of diffusion or metallization. Metallization: A process for providing ohmic contacts and interconnections by evaporating aluminum over the chip. Photolithography: A process to transfer geometrical pattern from the mask to the surface of the wafer. Photoresist: A light-sensitive material that hardens when exposed to ultraviolet light. Wafer: A thin disk of semiconductor in which number of ICs are fabricated simultaneously. Advantages of ICs over Discrete Components: Extremely small physical size Low power consumption Reduced cost Increased system reliability Increased operating speed Increase equipment density Improved function performance High yield Advances in integrated circuits Along with the advanced integrated circuits are that of the cores or microprocessors, which handle many of todays appliances from computers and cellular phones to digital microwave ovens. Digital memory chips and ASICs are examples of other groups of integrated circuits which are important to the modern information society. Whilst cost of designing and developing a complex integrated circuit is high, when costs are spread across typically millions of production units, the individual IC cost is reduced. The performance of Integrated circuits is high as the small size allows short traces, which then allows low power logic (for example CMOS), to be used at quick switching speeds. Integrated circuits have constantly migrated to smaller feature sizes over time thus, allowing more circuitry to be placed on each chip. The increase in capacity per unit area can be used to decrease cost and increase functionality, this can be seen in Moores law where it states that the number of transistors in an integrated circuit doubles every two years in a modern interpretation. Normally as the feature size shrinks, there can be seen improvements in everything. The cost per unit and the power consumption of switching go down, and the speed goes up. Integrated circuits with nanometer-scale devices have a variety of problems, one of which being current leakage, however these problems are not unconquerable and it is likely they will be solved, or improved at least, by the introduction of high-k dielectrics. As the power consumption and speed gains are apparent to the end user, there is competition among manufacturers to use finer geometries. The process/expected progress over the next few years, is described by the International Technology Roadmap for Semiconductors (ITRS). Popularity of ICs   Only a half century after their development was initiated, integrated circuits have become ubiquitous. Computers, cellular phones, and other digital appliances are now inextricable parts of the structure of modern societies. That is, modern computing, communications, manufacturing and transport systems, including the Internet, all depend on the existence of integrated circuit. Future scope of integrated circuits The future of integrated electronics is the future of electronics itself. The advantages of integration will bring about a proliferation of electronics, pushing this science into many new areas. Integrated circuits will lead to such wonders as home computers.or at least terminals connected to a central computer .automatic controls for automobiles, and personal portable communications equipment. The electronic wristwatch needs only a display to be feasible today. But the biggest potential lies in the production of large systems. In telephone communications, integrated circuits in digital filters will separate channels on multiplex equipment. Integrated circuits will also switch telephone circuits and perform data processing. Computers will be more powerful, and will be organized in completely different ways. For example, memories built of integrated electronics may be distributed throughout the machine instead of being concentrated in a central unit. In addition, the improved reliabil ity made possible by integrated circuits will allow the construction of larger processing units. Machines similar to those in existence today will be built atlower costs and with faster turn-around.

Friday, October 25, 2019

love :: essays research papers

Love is a word with many definitions. Although, Webster defines love as a strong feeling of attraction resulting from sexual desire; enthusiasm or fondness. But to me love is not just a feeling, but it is the way that you treat the ones you care for. You should treat the ones you love so considerately through your actions they'll know you care and love them. Love in my eyes, is making that sacrifice for someone, knowing that you might regret it sooner or later. Love is how you make another person feel when you are in their presence. Many people show or express their love for someone in many and different ways. To me love is in the actions not the words. The true meaning of love like what is the meaning of life is one of the questions that will remain unsolved forever. But right now the love is a great thing that should be treasured forever and valued as a important part in your life because it will effect all relationships, romantic or not. Love has not changed at all over the cours e of history and this makes it the most important emotion anyone could have. Most people take love for granted and worry about it always being there when they need it the most.   Ã‚  Ã‚  Ã‚  Ã‚  Family love is another type of love we can think about. It is the love we use between our intermediate family and our extended family members. Family love is said to be blind, only to show that love can be shown to anyone no matter condition or problems one can have. Of course we all know about the good times, hard times, and times we have as a family, but no matter what the situations are within the family, love is usaully a important part.   Ã‚  Ã‚  Ã‚  Ã‚   A close bond between two people can begin with a friendship. Whether it is a friendship between two guys, two girls, or one male and one female, these friendships will develop into love. It is not romantic love , but this type of love still connects people. Friends may fight or move to other areas, but friends will always have that connection they once shared. Romantic love is not always there at the beginning, but grows within us. When we finally find the love we have been looking for, I beleive you can not imagine life with anybody else.

Wednesday, October 23, 2019

How to Get a Fit Body

Stop moaning about being overweight and get moving! Everyone cares about their health but to be fit lots of hard work is required. To approve your aim, you must follow three difficult but necessary steps. Willpower, eating less and excercising daily are the most important things that you can do for ensure beautiful body. Belief in yourself is the first step to be fit. As we know doing nothing and just stupidly dreaming can’t help you with your plans. And of course you will waste your time. Firstly what you can do is to be confident that you will fulfill your aim. And of course if you begin to doubt you must submit all the advantages which could help you to support your body in balance. After all if you don’t do that it will be hard to continue your right way to be healthy and refuse to eat the sweets. One of the main responsibilities on diet is to restrict yourself from fatty food and sweets. The menu must be followed in all cases because you might not have another chance to make it up. Make sure you eat right and systematically because your body has adapt this kind of regime it is important for your health especially for strength. And if by any chance you still seem to be lazy to do that, then just shut your mouth. If you eat a lot, it certainly will be very dangerous and very difficult to lose weight by sport. The most effective way of burning calories is by excercising daily. By this man removes all shortcomings from the different part of body. You can have strengthen muscles, long beautiful legs and of course six or eight packs. That’s sounds great! Don’t lie front of the TV, don’t be so lazy and gloomy everything is possible to change in our world. Healthy diet is the best way to be fit. It is very important in our life because today people have a lot of different illnesses which can lead to death. It is very pity everyone can cure himself but not everyone can care about it. You need just think about. These advices will help you to be more satisfied and happy. Just belief yourself, eat more fruits and vegetables and do some sport. That’s all you need for perfect life. Take care!

Tuesday, October 22, 2019

Free Essays on KFCs Strategies

1- What did each of KFC’s three different corporate parents – Heublein, R.J. Reynolds and Pepsi Co – do to contribute to or hinder KFC’s growth and success? Conflicts appeared as a result of Hublein’s little experience in the fast restaurant market. As a result, there was low quality control, poor service and shortage on new restaurant openings. R.J Reynolds was also new to the business, so it decided to take a hands-off approach in management. Pepsi on the other hand had some experience in the industry. It interfered with KFC’s management and replaced it with its own. 2- What are the chief economic and business characteristics of the global fast food industry? The fast food industry is extremely large and it reported $320 billion in sales in 1997 for approximately 500,000 restaurants in the US. The market growth rate is 5.2% annually. It is considered as mature. The industry consists of numerous organizations and companies, ranging from McDonald’s to Checkers, and it is not limited to the United States. We can divide the industry into 6 groups of restaurants and chains: Ø Sandwich chains Ø Dinner houses Ø Griller Buffet Ø Family restaurants Ø Pizza Ø Chicken 3- What does a five-forces analysis of fast-food competition tell us about the overall strength/intensity of competitive pressures in this business? The rivalry among competing sellers: figuring the following: Ø Product line and services: efforts are made to extend the product offerings, sometimes beyond the traditional, for example when McDonald’s offered chicken burgers. Services are also considered as a competitive edge. Ø Pricing and promotions: pricing is critical for buyers and many chains use promotions especially when the offerings exceed demands. Ø Location and store format: is important likewise any business and has a direct effect on clients. The potential entry of new competitors: which is difficult s... Free Essays on KFC's Strategies Free Essays on KFC's Strategies 1- What did each of KFC’s three different corporate parents – Heublein, R.J. Reynolds and Pepsi Co – do to contribute to or hinder KFC’s growth and success? Conflicts appeared as a result of Hublein’s little experience in the fast restaurant market. As a result, there was low quality control, poor service and shortage on new restaurant openings. R.J Reynolds was also new to the business, so it decided to take a hands-off approach in management. Pepsi on the other hand had some experience in the industry. It interfered with KFC’s management and replaced it with its own. 2- What are the chief economic and business characteristics of the global fast food industry? The fast food industry is extremely large and it reported $320 billion in sales in 1997 for approximately 500,000 restaurants in the US. The market growth rate is 5.2% annually. It is considered as mature. The industry consists of numerous organizations and companies, ranging from McDonald’s to Checkers, and it is not limited to the United States. We can divide the industry into 6 groups of restaurants and chains: Ø Sandwich chains Ø Dinner houses Ø Griller Buffet Ø Family restaurants Ø Pizza Ø Chicken 3- What does a five-forces analysis of fast-food competition tell us about the overall strength/intensity of competitive pressures in this business? The rivalry among competing sellers: figuring the following: Ø Product line and services: efforts are made to extend the product offerings, sometimes beyond the traditional, for example when McDonald’s offered chicken burgers. Services are also considered as a competitive edge. Ø Pricing and promotions: pricing is critical for buyers and many chains use promotions especially when the offerings exceed demands. Ø Location and store format: is important likewise any business and has a direct effect on clients. The potential entry of new competitors: which is difficult s...